Human Body Cavity Ntc Temperature Sensor for Medical Monitoring Equipment

• Installation Type: Direct Plug
• Sensing Type: Resistive
• Contact: Contact
• Output Signal Type: Analog Type
• Production Process: Ceramics
• Material: Ceramics
• Model NO.: JP401
• Measuring Medium: Temperature
• IP Rating: IP64
• Certification: CE
• Customized: Customized
• Transport Package: Single Wire Packaging
• Trademark: Jingpu
• Origin: Hefei, Anhui
• HS Code: 90251910
• Production Capacity: 30000

Product Description

Brief Introduction

Medical human body cavity ntc temperature sensor for medical monitoring equipment ( esophgeal/ rectal temperature probe) be used for human body cavity temperature measurement, Used for the patient monitors. The sensor be composed of epoxy bead and Mono audio plug 6.3mm. Meanwhile, we also accept the customized plug or connector. The rated resistance value 2.252kΩ or 10kΩ. The measured temperature tolerance within  ±0.1ºC, compatible for replacement YSI400 series sensor. 

Product Features:

Epoxy encapsulation
Reusability
Temperature tolerance
(25~45)ºC±0.1ºC 
Operating temperature range: 0ºC~50ºC

 

Product Application:

Suitable for medical monitoring equipment

 

Structure & Dimensions:

 

 

NO.	Name	Material Specification	QTY.	Remarks
1	Chip	NTC	1	/
2	Probe	Epoxy Resin	1	gray
3	Wire	24AWG/1C OD3.1 Shielded round sheath wire	1	gray
4	Plug	6.3MP-φ6.3*31-50	1	gray

Standard packing (inner packing): 1 pcs/polybag

Operation Notice:

1.Application:Temperature measure ; 

2.The current flowing through the NTC is controlled within the Pmax range to avoid the measurement error caused by the self-heating of the component.

 

3.Avoid excessive heat shock,The hot air blow shoul d beat least 30mm to the probe in case heat shrink protection tube need to be attached.

 

4.torage Temperature 0ºC~50ºC,30%~80%RH;Avoid in a corrosive gas and sunlit environment; After opening the package, it needs to be sealed again.

5.According to the structure of Glass coating NTC thermistor, when end user install, to avoid the epoxy head subjected too much tensile force and bending force from the lead wire,The lead wire shall be controlled at a bending point or a force point on a lead wire 6mm or less below the sealing head.So as not to hurt the chip, resulting in resistance drifting and even open circuit, esepcially when the component is heated.